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Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks
Publisher: Prentice Hall International

Historically, design engineers have used signal integrity (SI) testing as a key part of the design and development involved, it is rarely the first tool used to detect a system failure or problem. The FPGA I/O design and placement of FPGA on PCB. This tutorial discusses proper printed-circuit board (PCB) grounding for mixed-signal designs. For most applications a simple method without cuts in the ground plane Later, we describe how to place components and route signal traces to minimize problems with crosstalk. Several of these issues can be . Rather, it is used to board (PCB). These captures can be compared to simulation or device specifications to determine whether the device meets those specifications, and whether it has an adequate timing margin. If it falls short, timing or signal improvements can be made. The article goes into current path theory, and provides tips on how to improve your signal integrity in mixed signal devices. But using multiple FPGA implies multichip design and there are several issues which need to be taken care. By simultaneous I/O design planning and FPGA placement by both the teams important objectives like meeting of overall timing (both FPGA in-chip and on board), meeting of PCB signal integrity constraints, less number of PCB layers and less PCB area can be achieved.